JPH0427703B2 - - Google Patents
Info
- Publication number
- JPH0427703B2 JPH0427703B2 JP57138684A JP13868482A JPH0427703B2 JP H0427703 B2 JPH0427703 B2 JP H0427703B2 JP 57138684 A JP57138684 A JP 57138684A JP 13868482 A JP13868482 A JP 13868482A JP H0427703 B2 JPH0427703 B2 JP H0427703B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- etching
- insulating film
- sio
- fluid material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76237—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials introducing impurities in trench side or bottom walls, e.g. for forming channel stoppers or alter isolation behavior
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Drying Of Semiconductors (AREA)
- Element Separation (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13868482A JPS5928358A (ja) | 1982-08-10 | 1982-08-10 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13868482A JPS5928358A (ja) | 1982-08-10 | 1982-08-10 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5928358A JPS5928358A (ja) | 1984-02-15 |
JPH0427703B2 true JPH0427703B2 (en]) | 1992-05-12 |
Family
ID=15227684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13868482A Granted JPS5928358A (ja) | 1982-08-10 | 1982-08-10 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5928358A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984548A (ja) * | 1982-11-08 | 1984-05-16 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
JPH0738383B2 (ja) * | 1984-10-29 | 1995-04-26 | 日本電信電話株式会社 | 半導体装置の製造方法 |
JPS6224627A (ja) * | 1985-07-25 | 1987-02-02 | Sony Corp | ドライエツチング方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5363871A (en) * | 1976-11-18 | 1978-06-07 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
JPS5791537A (en) * | 1980-11-29 | 1982-06-07 | Toshiba Corp | Manufacture of semiconductor device |
-
1982
- 1982-08-10 JP JP13868482A patent/JPS5928358A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5928358A (ja) | 1984-02-15 |
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